ACF Tabletop JP

Tabletop Laminator卓上ACF貼付装置

Introducing PrecisionX ACF Laminator - The Ultimate Tabletop Solution with Integrated Stage X/Y Control. XXXXXXXXXXXXXXXXXXXXXXX

In the realm of advanced manufacturing and electronics assembly, the demand for precision and efficiency is ever-increasing. The PrecisionX ACF Laminator emerges as a cutting-edge solution designed to meet the demands of industries that require highly accurate ACF (Anisotropic Conductive Film) lamination. This innovative machine integrates state-of-the-art technology to ensure superior control, efficiency, and user-friendliness, making it an indispensable tool in modern manufacturing processes.

Additional Features:

Integrated X/Y Stage (Stepped Motor): The integrated X/Y stage with a stepped motor is a critical feature for precise positioning and alignment of components and substrates. This advancement ensures accuracy at every step of the lamination process, even for the most intricate components.

Rapid Tooling Changeover: Rapid tooling changeover capabilities offer efficiency in manufacturing. Manufacturers can swiftly switch between different projects and tooling setups, saving valuable time and minimizing downtime.

Highly-responsive PID Controllers for Temperature Control: The inclusion of PID controllers for temperature management is a game-changer. These controllers maintain temperature stability with unmatched responsiveness, reducing material wastage and ensuring consistently high-quality lamination.

Touchscreen Interface for User-Friendly Operation: Users can easily program, monitor, and adjust settings through an intuitive and user-friendly interface.

General Specifications:

TTL-6010TTLS-3030 with XY Stage
ACF Type 2 layers
Size & WeightW500xD460xH514mmW650xD750xH690mm
Approxiately 85kgApproxiamately 140kg
Heating methodConstant Heat
Consumption0.6kVA2.2kVA
Heat tool material SUS440C
Heat Tool sizeLength: 5-100mm - Width: 1-8mm
Heat Tool flatness±5µm
Power/Input AirAC110-220V ± 10%, Single phase /0.1-0.6 Mpa
ACF Width/ LengthWidth: Min: 1.0mm Max 6.0mm / Length: Min: 2.0mm Max 50.0mm
Product size rangeW100mm x L120 (Center Bonding Position)W210mm x L220 (Center Bonding Position)
Substrate StageInterchangable Stage - Max W100 x D98mmMax W300 x D250mm/ Stopping Accuracy ±20µm
Work SizeMin: 20mm (L) x 20mm (W) & Max: 150mm (L) x 100mm (W)Interchangable Stage - Max W210 x 215mm ±20µm
Work ThicknessMin: 0.3mm - Max:1.1mm

The Ito TTAB 1008CR/2525AR is a tabletop aligner-bonder with rotary stage to improve throughput. It is available in both constant Heat and ActiveHeat configurations and features a unique stage support mechanism which allows the machine to be used with complex 3D structures such as camera modules.

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