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ACF Precision Bonder

Ito V-Star Multi-Purpose Automation Platform

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Ito America, Ito China, Ito Europe, Ito India, Ito Japan, Ito Thailand

Introducing ACF Precision Bonder: Perfecting ACF Laminate Bonding with Accuracy

In the fast-paced realm of electronics manufacturing, precision is a non-negotiable standard. The ACF Precision Bonder, the ultimate component of the ACF Vstar semi-production line, is engineered to excel in precise ACF Laminate bonding with unparalleled accuracy. Designed for seamless integration into universal systems, it brings a new level of perfection to industries that rely on bonding processes, particularly in automatic soldering, welding, and staking. In this article, we explore the remarkable features and applications of the ACF PrecisionBonder.

Additional Features:

Independent Operation: The machine can function independently, streamlining bonding processes without requiring constant manual oversight. This autonomy enhances operational efficiency and minimizes labor dependency.

Upgradability for Custom Applications: The ACF PrecisionBonder is upgradeable to accommodate various applications, with a special focus on automatic soldering, welding, and staking. Its adaptability ensures that it can align with the specific demands of different industries, even as those needs evolve over time.

Modular Component Integration: The machine offers modular component integration, allowing users to easily add various heads, manipulators, valves, drivers, or other end effectors to their existing ACF equipment. This adaptability ensures that equipment can be tailored to suit specific applications, making it a highly versatile solution.

Seamless Third-Party Integration: The ACF PrecisionBonder seamlessly interacts with third-party systems, both mechanically and electrically. This integration simplifies the incorporation of additional equipment and technologies from various sources, enhancing the overall efficiency of manufacturing processes.

General Specifications:

ModelVB-3030
Final Bonding Placement *X: ±10μm/3σ ; Y: ±10μm/3σ
Numbers of Head2
Heating MethodConstant Heat (Ambient to 350°C )
Bonding Force Range10 to 157 (N)
Heat Tool Size60(L) x 15(W)mm
Stage XY & Head Z MotionServo Motor

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