Prepare to experience a game-changing solution in the world of Anisotropic Conductive Film (ACF) processing. Our “All-in-One ACF System” is engineered to streamline the ACF assembly process with unprecedented efficiency and convenience. By combining laminating, aligning, and bonding functions into a single machine, this innovative system is a breakthrough for R&D, small-scale production, and any setting where space-saving and cost-effectiveness are paramount.
Triple Functions, One Machine: The All-in-One ACF System combines lamination, alignment, and bonding processes into a single, space-saving unit, simplifying the ACF assembly workflow.
Versatile and Cost-Effective: Ideal for R&D purposes and small-scale production, this system optimizes both time and cost, reducing the need for multiple machines.
Enhanced Space Efficiency: Say goodbye to cumbersome, multi-machine setups; our system maximizes space utilization, making it suitable for compact workspaces.
Precision and Accuracy: Ensure the highest level of ACF assembly precision and quality with the All-in-One system, enhancing the reliability of your output.
Streamlined Workflow: Minimize downtime and eliminate the need for manual transfers between processes, enhancing overall efficiency and productivity.
| VLB2S2H-1510 | ||
|---|---|---|
| Laminator | Bonder | |
| Heating Method | Constant Heat | Ceramic ActiveHeat™ |
| Heat Tool Size | Maximum 60mm ACF lamination length. | Length: 5-100mm Width: 1-8mm |
| Size and weight | WxDxH & Approximately 250Kg | |
| Utilities | Power: AC220V ±10%, Single Phase | |
| Process Control Systems | Controller: Mitsubishi PLC | |
| User Interface: Mitsubishi Touch Panel | ||